Standard  fabric catastrophic performance Standard fabric catastrophic performance

By Pär Gester, SMT Express

The fabric in SMT stencil cleaning rolls must have a so called high coverage. Otherwise, the fabric will have areas where the density is either to high or to low to perform well. This short article shows why.

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By Pär Gester, SMT Express

If your DEK printer is equipped with a nylon bracket for the stencil roll, you need a Hyperclean roll with smaller core diameter. Hyperclean PP4200 is also sold as DEK UFP-ECO and Scanditron Stencil Roll

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By Richard Vereijssen, Yamaha Motor IM Europe

The latest generations of ultra low-profile and highly miniaturised components, such as QFN ICs, LGA power devices, and 03015 (0.3mm x 0.15mm) chip resistors challenge surface mount manufacturers to control screen printing within a narrower window, particularly in respect of positional alignment and solder-paste volume. At the same time, however, manufacturers are also under pressure to minimise setup and changeover times, to maintain productivity. In high-volume scenarios, there is also pressure to sustain fast cycle times.

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Solder balls trapped in Hyperclean Solder balls trapped in Hyperclean

By Pär Gester, SMT Express

Solder paste screenprinting is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screenprinting is the under stencil cleaning process and one of the key materials in this process is the cleaning fabric.  This IPC report describes how cleaning fabrics can be tested and it also tells how big differences it can be between different materials.

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