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Hyperclean SMT printing cleaning media

The perfect partner to Hyperclean rolls, Hyperclean solvents! Efficient removal of solder paste and SMT-adhesive residues from stencil underside grants repeatable and stable cleaning steps which help to achive highquality printing results. The innoative formulations combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area. 

  • High flashpoint
  • Non deterioating to plastics
  • Minimal Odor
  • Total solution for your SMT Printer with Hyperclean stencil rolls
The cleaning media is used straight at room temperature either put within the cleaning tank of the automatic stencil printer or used straight from the original package depending on printer brand and manufacturer.

SUC 61A

For all standard stencil cleaning purposes.

This water-based, pH-neutral cleaning media efficiently removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process within automatic stencil printers.

Hyperclean SUC 61A shows excellent wetting properties to cleaning rolls and papers as far as stencil materials which grant stable and high-quality cleaning results.

SUC61A shows great evaporation properties and due to the homogeneous formulation, smudges and cleaning media droplets are minimized.

SUC 63S

For hard to clean solder paste or SMD adhesives.

This solvent based, pH-neutral cleaner blend efficiently removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process within automatic stencil printers.

Hyperclean SUC 63S shows excellent wetting properties to cleaning rolls and papers as far as stencil materials which grant stable and high-quality cleaning results.

SUC63A has a well-balanced evaporation rate.

Contact us today for starting your Hyperclean evaluation

Technical data SUC61A
 

Appearance/Consistancy: Colorless to slightly yellow, clear
Application: Ready-to-use
pH-value: Neutral
Density at 20 °C: 0,965 +/- 0,005 g/cm³
Boiling point/boiling range: >100°C
System: Waterbased
Flash point: 61°C
Operations temperature: Room temperature
Reliable cleaning results with: Leaded, lead-free, no-clean solder pastes
SMT-adhesives
Shelf life: 36 month
Storage conditions: Ideal in original packaging at 10°C-25°C
Transportation: Non-DG


 

Technical data SUC63S
 

Appearance/Consistancy: Colorless to slightly yellow, clear
Application: Ready-to-use
pH-value: Neutral
Density at 20 °C: 0,821 +/- 0,005 g/cm³
Boiling point/boiling range: 170°C-210°C
System: Waterbased
Flash point: 63°C
Operations temperature: Room temperature
Reliable cleaning results with: Leaded, lead-free, no-clean solder pastes
SMT-adhesives
Shelf life: 36 month
Storage conditions: Ideal in original packaging at 10°C-25°C
Transportation: Non-DG