SMT_PNG_full

2015 > 03

Solder balls trapped in Hyperclean

By Pär Gester, SMT Express

Solder paste screenprinting is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screenprinting is the under stencil cleaning process and one of the key materials in this process is the cleaning fabric.  This IPC report describes how cleaning fabrics can be tested and it also tells how big differences it can be between different materials.

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Electronic manufacturing insights found here

This news section is all about the SMT soldering paste printing and cleaning process. 

Electroncis manufacturing is facing new challanges every day. The solder printing process is the fundament for subsequent process steps. There is no longer room for using the "cheapest" materials. 

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