
Hyperclean SMT printing cleaning media
The perfect partner to Hyperclean rolls, Hyperclean solvents! Efficient removal of solder paste and SMT-adhesive residues from stencil underside grants repeatable and stable cleaning steps which help to achive highquality printing results. The innoative formulations combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area.
- High flashpoint
- Non deterioating to plastics
- Minimal Odor
- Total solution for your SMT Printer with Hyperclean stencil rolls
SUC 61A
For all standard stencil cleaning purposes.
This water-based, pH-neutral cleaning media efficiently removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process within automatic stencil printers.
Hyperclean SUC 61A shows excellent wetting properties to cleaning rolls and papers as far as stencil materials which grant stable and high-quality cleaning results.
SUC61A shows great evaporation properties and due to the homogeneous formulation, smudges and cleaning media droplets are minimized.
SUC 63S
For hard to clean solder paste or SMD adhesives.
This solvent based, pH-neutral cleaner blend efficiently removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process within automatic stencil printers.
Hyperclean SUC 63S shows excellent wetting properties to cleaning rolls and papers as far as stencil materials which grant stable and high-quality cleaning results.
SUC63A has a well-balanced evaporation rate.
- SUC brochure.pdf 618 KB
Contact us today for starting your Hyperclean evaluation
Technical data SUC61A
Appearance/Consistancy: | Colorless to slightly yellow, clear |
Application: | Ready-to-use |
pH-value: | Neutral |
Density at 20 °C: | 0,965 +/- 0,005 g/cm³ |
Boiling point/boiling range: | >100°C |
System: | Waterbased |
Flash point: | 61°C |
Operations temperature: | Room temperature |
Reliable cleaning results with: | Leaded, lead-free, no-clean solder pastes SMT-adhesives |
Shelf life: | 36 month |
Storage conditions: | Ideal in original packaging at 10°C-25°C |
Transportation: | Non-DG |
Technical data SUC63S
Appearance/Consistancy: | Colorless to slightly yellow, clear |
Application: | Ready-to-use |
pH-value: | Neutral |
Density at 20 °C: | 0,821 +/- 0,005 g/cm³ |
Boiling point/boiling range: | 170°C-210°C |
System: | Waterbased |
Flash point: | 63°C |
Operations temperature: | Room temperature |
Reliable cleaning results with: | Leaded, lead-free, no-clean solder pastes SMT-adhesives |
Shelf life: | 36 month |
Storage conditions: | Ideal in original packaging at 10°C-25°C |
Transportation: | Non-DG |